Holding element for holding a carrier board

ABSTRACT

Holding element with a holding clip, arrangement with a carrier board and a holding element, and aA holding element ( 2 ) with a holding clip, an arrangement of a holding element ( 2 ) with a carrier board ( 32 ) and an arrangement of a holding element with a carrier strip are described, the carrier strip and the holding element being of integral construction. Advantageously, the holding element has two legs, with which a holding clip can be placed on a carrier board. In this way, a stable holding element is produced, which stands without further assistance on a base-board and can hence be easily soldered.

[0001] The present invention relates to a holding element for holding acarrier board. More in particular, the present invention relates to aholding element having a holding clip with a first and a second holdingarm, wherein the holding arms extend from a supporting region andbetween the holding arms a receiving region is formed, wherein the firstholding arm is connected to a first leg and the second holding arm isconnected to a second leg, said legs each having a base in an endregion. The present invention further relates to a arrangement with acarrier board and a holding element, and an arrangement with a holdingelement and a carrier strip.

[0002] Holding elements are used in electronic circuits to hold aprinted circuit board and preferably at the same time to establish anelectrical contact between the printed circuit board and a base board.In this connection, the holding element is preferably soldered to thebase-board and the printed circuit board is inserted into a receivingregion of the holding element.

[0003] U.S. Pat. No. 4,486,066 discloses a holding element, whichcomprises a holding clip with two holding arms, the holding armsextending from a central supporting region. The holding arms are bentround at a given distance from the supporting region and are taken withend portions to below the level of the supporting region. The endportions of the holding arms are of linear construction and are pushedthrough contact holes of a first printed circuit board and then solderedto the first printed circuit board. After soldering the holding arms, afurther printed circuit board can be pushed into the U-shaped receivingregion between the holding arms. The further printed circuit board isheld by the holding arms and at the same time electrically connected viathe electrically conductive holding element to conductors that arearranged on the first printed circuit board.

[0004] U.S. Pat. No. 4,061,405 discloses a device for handling holdingelements, in which the holding elements are in the form of U-shapedholding clips having two holding arms. Starting from a centralsupporting region, the holding arms are bent round at a given distancefrom the supporting region and extend with the ends of the holding armsto below the level of the supporting region. The holding clip is in theform of a bent wire. A carrying rail with receiving openings is providedfor transportation of a plurality of holding clips. The carrying rail ispushed from above onto a given number of holding clips arranged in arow. In the process, two holding arms of a holding clip are gripped byopposing regions of the carrying rail. In addition, on the carrying railthere is formed a central member, which is introduced into the receivingregion of the holding clip. By biasing the holding arms towards thereceiving region, the central member is firmly clamped by the holdingclips, thus rendering possible transportation of the holding clipsduring which the holding clips maintain their position in the row.

[0005] U.S. Pat. No. 4,978,307 discloses an electrical base forsubstrates, in which the electrical base has a holding clip with twoholding arms. The two holding arms start from a central supportingregion and define a receiving region. A first holding arm is bent roundat a given distance from the central supporting region and joined to afirst leg. The first leg is guided towards the supporting region and hasa planar contact area with which the holding element is soldered to aprinted circuit board. The second holding arm is joined to a carrierstrip, one carrier strip being joined to a plurality of holdingelements. After soldering up the holding elements and breaking thecarrier strip away from the second holding arm, a substrate is insertedinto the receiving region. The substrate is fixedly held by the holdingarms and at the same time electrically connected with the printedcircuit board via the holding arms and the first leg.

[0006] The holding element described has only one leg, so that beforeinsertion of the substrate the holding element must first be fixedlysoldered to a printed circuit board and only then can the carrier stripbe broken away. Manipulation of the holding element is thereforerelatively awkward.

[0007] The problem underlying the invention consists in providing aholding element having a holding clip, an arrangement with a carrierboard and a holding element, and an arrangement with a holding elementand a carrier strip, thereby permitting simpler manipulation of theholding element when it is being joined to the printed circuit board orbeing fastened to a carrier board.

[0008] The problem of the invention is solved by a holding element asdefined in the preamble which according to the present invention ischaracterised in that the holding element is made of a strip materialand in that the first and second holding arms each have an outward bendforming a transition into the first and second leg respectively.

[0009] Further advantageous embodiments of the invention are specifiedin the dependent claims.

[0010] One advantage of the holding element consists in that the firstand the second leg each have a base in an end region. By virtue of thearrangement of two legs with bases, the holding element stands stably ona printed circuit board and can consequently be soldered up to a printedcircuit board without further fixing means. In addition, even with aninserted carrier board, the holding element stands stably on a printedcircuit board. This offers the advantage that a pre-assembled componentcomprising the holding element and a carrier board can be produced andsold as a supplied part. The pre-assembled component can be connectedwith a printed circuit board in a simple manner by placing the componenton the printed circuit board and soldering it up free-standing withoutfurther support to the printed circuit board.

[0011] The outward bend forming the transition between each holding armand its associated leg provides an advantageous shape having resilience.This resilience facilitates the insertion of a carrier plate.

[0012] A symmetrical construction of the first and the second leg isespecially advantageous. A precise position of the receiving region isconsequently defined, and a carrier board inserted in the receivingregion is likewise precisely aligned with respect to the position of thebases.

[0013] Moreover, by the use of two legs, thermally differentcoefficients of expansion between a printed circuit board and theholding element can be better equalised. Compressive stresses are alsobetter cushioned.

[0014] In a preferred embodiment, the holding element is produced fromband or strip material by a bending process. Owing to the bendingprocess, an inexpensive manufactur of the holding element is possible.

[0015] In a preferred embodiment, the first and/or the second leg has acurved surface in the region of its base. The curved surface offers theadvantage that the leg rests on a printed circuit board virtually with aone-dimensional surface. In this way, tilting of the holding element inthe lengthwise direction of the holding element is automaticallyavoided. Moreover, the curved surface offers the advantage that whensoldering up the printed circuit board, the heated solder finds adefined angle of flow and hence the heated solder reliably wets the leg.This improves the soldering result.

[0016] The curvature is preferably formed only along the longitudinalaxis of a leg, so that the leg is in the form of a curved strip.

[0017] In a preferred embodiment, the holding arms are arranged a givendistance apart from one another and are biased to prevent outwardbending. In this way, a carrier board that is pushed into the receivingregion, and in the process presses the holding arms outwards, isreliably retained by the holding element. The carrier board and theholding element can therefore be transported or stored before thecarrier board is soldered up with the holding element, which means thatmanufacture can be more flexible.

[0018] The construction of the central supporting region as a virtuallyflat surface is especially advantageous. The provision of a virtuallyflat surface enables a carrier board, which also has a flat side edge,to be placed with its flat side edge on the supporting region. Becausethe surfaces that lie one on top of the other are plane, the carrierboard is securely held in a given position by the holding arms. Lateraltilting is therefore rendered more difficult.

[0019] In a further advantageous embodiment, a first solder layer isapplied to the supporting region of the holding element. The firstsolder layer is advantageously used for joining to the carrier board.

[0020] A preferred choice of material for the holding element comprisesa copper alloy, which is covered at least partly with a layer of tin.The copper alloy is relatively robust and at the selected dimensionsoffers satisfactory security against breaking and furthermore thenecessary resilience for the holding arms. The tin layer offers theadvantage of a simple solder layer join and is furthermoreenvironmentally acceptable, since it contains no lead.

[0021] A further advantageous construction of the holding element isachieved in that the lower edge of the central supporting region isarranged above a straight connecting line that runs between the bases ofthe legs of a holding element. In this way, when the holding element ispositioned with its legs on a printed circuit board, it can be ensuedthat the holding element rests with a first and second base on theprinted circuit board and resiliency of the carrier board is ensured.

[0022] A preferred radius for the curvature of the base lies within therange from 0.3 to 0.7 mm. For this radius range, especially advantageousflow conditions for the solder were ascertained.

[0023] A further advantageous embodiment of the invention consists inthat at least part of the central supporting region across the entirewidth of the holding element is manufactured from an insulatingmaterial. The insulating connecting piece electrically isolates the twolegs of a holding element from one another, thus providing theopportunity for the printed circuit board to be connected via a singleholding element to two contacts of different voltage.

[0024] The holding element described offers the advantage that anarrangement comprising a carrier board and at least one holding elementcan be pre-assembled and on account of the stability of the holdingelement is set up on a printed circuit board in a separate productionstep and only then soldered to the printed circuit board. Apre-assembled component consisting of at least one holding element and acarrier board can therefore be sold.

[0025] An advantage of an arrangement with a holding element and acarrier strip that are integrally constructed from a strip materialconsists in that the carrier strip has ties that are arranged side byside, the ties have a given lateral spacing from one another and aholding element is arranged between two ties. This arrangement has theadvantage that the holding elements are held firmly by the ties.Moreover, a relatively large amount of material of the sheet isavailable in the form of a strip for the construction of the holdingelement. By virtue of the long strip, the holding element can be formedwith two relatively long legs, without the material thickens of theholding element being reduced. The holding element is therefore ofrelatively stable construction.

[0026] In a preferred embodiment, the carrier strip comprises a firstand a second row of ties, the ties of the two rows being arrangedsymmetrically with respect to and opposite one another. In thisembodiment, a holding element is connected to a tie of each of the firstand second row. The arrangement of the ties and the holding elementsproduces a stable retention of the holding element in the carrier strip.The arrangement comprising holding element and carrier strip istherefore relatively robust and not affected by mechanical influences.

[0027] In a further preferred embodiment, the carrier strip has at leastone spacer, which is preferably taken further upwards or downwards thanthe holding element extends upwards or downwards from the carrier strip.This embodiment offers the advantage that the arrangement comprisingcarrier strip and holding elements can be transported in the form of anendless band rolled up on a reel, release strips being provided betweenthe individual layers of the carrier strip. By virtue of the spacers,however, the carrier strips rest against the release strips only withthe spaces, so that the holding elements are protected from damage.

[0028] The spacers are preferably formed on the carrier strip betweentwo ties, and preferably lie on one axis with a holding element. Theexisting material of the sheet can in this way be utilised at the sametime to produce the spacers. Moreover, the spacers are preferablyarranged on opposing sides of a holding element, so that the holdingelement is well protected.

[0029] In a preferred embodiment, the spacers, which are arranged in arow on one side of the carrier strip, are constructed alternatelyupwards and downwards. This ensures that the holding elements arereliably protected.

[0030] The invention is explained in detail in the following, withreference to exemplary embodiments illustrated in the figures, in which

[0031]FIG. 1 shows a carrier strip and holding elements in the form of aband,

[0032]FIG. 2 shows a cross-section through a holding element and acarrier strip,

[0033]FIG. 3 shows a cross-section through a holding element to anenlarged scale,

[0034]FIG. 4 shows a holding element with carrier board,

[0035]FIG. 5 is a perspective view of a carrier strip with a pluralityof holding elements, and

[0036]FIG. 6 shows a holding element with connecting piece.

[0037]FIG. 1 shows merely by way of non-limiting example a carrier strip1 with a plurality of holding elements 2. The carrier strip 1 and theholding elements 2 are integrally formed from a strip material. Thestrip has a given width of 10 to 30 mm, a given thickness of 0.1 to 0.6mm and any desired length. During manufacture, to begin with fiststamped regions 3 are stamped out, these regions are in strip form anddefine ties 4, a holding strip 5 and two spacer strips 6. The firststamped area 3 is shown by a broken line. The first stamped area 3 isarranged substantially in the form of an elongate strip symmetricallywith respect to a center line 7, and is taken via a rectangular recess44 in the region of the centre line 7 upwards as far as the adjacentholding strip 5. In this way, two opposing ties 4 are defined. A holdingstrip 5 is joined laterally by way of a respective connecting area 8with a right and a left tie 4. The two connecting areas 8 are eacharranged laterally offset by a given spacing from the centre line 7. Thecentre line 7 runs through the middle of a supporting region 11.

[0038] The holding strip 5 and the space strips 6 lie on a straight lineand are preferably the same width. Each of the two spacer strips 6 isassociated with a respective end of the holding strip 5.

[0039] The holding strip 5 is re-shaped in a subsequent forming processinto a holding element 2. The spacer strip 6 is re-shaped in asubsequently forming process into an upper spacer 9 or a lower spacer10. Appropriate forming tools are used for the forming process.

[0040] The carrier strip 1 comprises a first and a second lateral strip16, 17, to which the ties 4 and the spacers 9, 10 are fastened. Feedholes 18 are made in the first and second lateral strips 16, 17, inwhich advancing pawls engage when conveying the carrier strip 1 to amanufacturing arrangement. The first and the second lateral strips 16,17 are each integrally connected with a spacer strip 6, the spacerstrips 6 being associated with a holding strip 5.

[0041]FIG. 2 shows a diagrammatic cross-section through the carrierstrip 1 and a holding element 2. During the shaping process for theholding element 2, care is taken that the central supporting region 11substantially retains the unchanged plane face of the sheet-form band,from which the carrier strip 1 and the holding elements 2 are formed. Aplane face 14 is therefore available without any special processingsteps. Starting from the central supporting region 11, two upwardlyextending holding arms 12, 13 are shaped. The first and the secondholding arm 12, 13 extend from the plane face 14 of the middlesupporting region 11 and are bent upwards and inwards in a first bend 15mirror-symmetrically with respect to the centre line 7. It is clearlyapparent from this view that the lower spacer 10 extends furtherdownwards from the carrier 1 than the holding element 2. The upperspacers 9 extend analogously further upwards away from the carrier strip1 than the holding element 2. In this way, the space that the holdingelement 2 occupies above and below the carrier strip 1 is safely guardedby the upper and the lower spacers 9, 10 respectively. Normally, carrierstrips 1 with holding elements 2 are stored and transported in the formof a band, a spacer layer in the form of a paper strip being insertedbetween the individual layers of band. In this connection, the paperstrip lies against an upper spacer 9 of a lower carrier strip 1 andagainst a lower spacer 10 of an upper carrier strip 1. The holdingelements 2 are reliably protected in this way against damage.

[0042] Referring to FIG. 2, the connecting areas 8 by means of which atie 4 is joined to a holding element 2 are also recognisable. Theconnecting areas 8 are taken across the entire thickness of the centralsupporting region 11 and have only a small width of <1 mm. This small,two-dimensional connection enables the holding element 2 to be separatedfrom the carrier strip 1 with little force and without damage by beingbent through 90°.

[0043] The exact construction of the holding element 2 is explained indetail with reference to the following FIG. 3. After the shaping processand separation of the holding element 2 from the carrier strip 1, theholding element 2 is in the form illustrated in FIG. 3. The holdingelement 2 comprises a holding clip 19, which comprises the centralsupporting region 11 and the first and second holding arms 12, 13adjoining the same. By virtue of the U-shaped construction of theholding clip 19, a receiving region 31 that is suitable for receiving acarrier board 32 (FIG. 4) is formed.

[0044] The first and the second holding arm 12, 13 converge followingthe first bead 15 to a given minimal distance apart, and each then bendsoutwards again into a second bend 20. After the second bead 20, thefirst and the second holding arm 12,13 merge into a first and second leg21, 22 respectively. The first and the second leg 21, 22 have a firstand second portion 23, 24 respectively, which is guided approximatelyparallel to the central supporting region 11. The first and the secondportion 23, 24 merge by way of a third bend 25 into a third and fourthportion 26, 27 respectively. The third and fourth portion 26, 27 istaken to a level below the central supporting region 11 and merges byway of a fourth bend 28 into a first and second end portion 29, 30respectively. The underside of the fourth bend 28 preferably has aradius R in the range between 0.3 and 0.8 mm. The fourth bend 28 isarranged in the first and in the second leg 21, 22 in such a way that anunderside of the central supporting region 11 lies above a connecting inbetween the fourth bends 28 of the first and the second leg 21, 22. Thethird and the fourth portions 26, 27 are in the form of straightportions and form an angle β of less than 90° with the plane of thesupporting region 11. The first and the second legs 21, 22 arepreferably arranged mirror-symmetrically with respect to the centre line7.

[0045] By virtue of the fourth bend 28, when placed on a printed circuitboard the holding element 2 lies thereon with a linear base 45, so thattilting in the longitudinal direction of the holding element 2 isavoided. Furthermore, tilting in the transverse direction is made moredifficult.

[0046] In a preferred embodiment, a solder layer 33 is applied to thecentral supporting region 11. In a further special embodiment solder 33is applied to the surface of the first and second holding arms 12, 13and of the supporting region 11 that are associated with the receivingregion 31. In a preferred embodiment, the solder layer is introducedinto a recess 34 formed in the holding arms 12, 13 and the supportingregion 11. If the recess 34 is used, the recess 34 is filled with solderplane-parallel to the surface of the holding arms and of the centralsupporting region 11. Once a carrier board 32 (FIG. 4) has beeninserted, the solder layer 33 or the solder is heated and in this waythe carrier board 32 is fixedly joined to the holding element 2.

[0047]FIG. 4 shows an arrangement of a holding element 2, into thereceiving region 31 of which a carrier board 32 has been partlyinserted. Once the carrier board 32 has been inserted into the receivingregion 31, the ties 4 can be broken away from the holding element 2 andthe resulting two parts cam be pulled away laterally with the first andsecond lateral strips 16, 17. A simple detachment and removal of thecarrier strip 1 is therefore possible in this manner.

[0048] In a preferred embodiment, the carrier strip 1 is not removeduntil after the holding element 2 has been soldered onto the carrierboard 32.

[0049] Separation of the ties 4 from the central supporting region 11 iseffected, for example, by pressing the ties 4 downwards. To do this, acomb-like pressure tool, for example, is used, which lies withcorresponding knock-out pins on the ties 4 and presses the ties 4downwards and breaks them away from the holding elements 2.

[0050] The pre-fabricated component comprising holding element 2 andcarrier board 32 is subsequently placed with the bases 45 on solderareas 38 of a baseboard 37 and soldered.

[0051] The base-board 37 is in the form, for example, of a printedcircuit board with electronic circuits 39 that are connected to thesolder areas 38 by a strip conductor 40. Since the holding elements 2are manufactured from an electrically conductive material, an electricalconnection between the electronic circuit 39 of the base-board 37 and asecond electronic circuit 41 that is applied to the carrier board 32 isproduced by way of the holding elements 2. The second electronic circuit41 is connected with the holding element 2 so as to be electricallyconductive by way of a second strip conductor 42. The carrier board 32can be in the form, for example, of ceramics or in the form of a printedcircuit board or can be made of other materials.

[0052] The carrier board 32 preferably has a side edge 43 that is ofplane construction and is associated with the plane face 14 of thesupporting region 11. By virtue of the plane construction of the sideedge 43 and the plane face 14, a relatively stable retention of thecarrier board 32 in the holding element 2 is achieved. This counteractslateral tilting of the carrier board 32. The curvature of the base 45 isarranged in the longitudinal axis of the third and fourth parts 26, 27,which are formed perpendicular to the direction of curvature as a flatsurface.

[0053] The holding element is preferably manufactured from a copperalloy, the surface of the holding element being coated at least partlywith a tin layer 48. In particular the bases 45 are coated with tin. Thetin layer 48 facilitates solder to a solder layer.

[0054]FIG. 5 shows a perspective view of the carrier strip 1 and theholding elements 2. It is clearly apparent that in each case an upperand a lower spacer 9, 10 are aligned in a row on the first and secondside strips 16, 17 respectively, and that in each case two spacers 9, 10arranged side by side are oriented alternatively upwards and downwards.The alternation between an upper and a lower spacer 9, 10 means that theholding elements 2 are shielded relatively well with respect to anintermediate layer.

[0055] By the arrangement of two opposing rows 46, 47 of ties 4, the twoparts resulting from detachment of the ties 4 from the holding elements2 can be removed by pulling away the two parts laterally outwards. It istherefore possible for example, to insert the carrier board 32 in theholding elements 2 and to solder it fixedly to the holding elements evenbefore the carrier strip 1 has been detached from the holding elements2. Furthermore, the arrangement of the ties 4 at the same level as thecentral supporting region 11 has the advantage that the receiving region31 is not covered by ties 4. A carrier board 32 can therefore beinserted into the receiving region 31 without being obstructed by ties4.

[0056] The arrangement of carrier strip with ties 4 and holding elements2 connected therewith illustrated in FIGS. 1, 2 and 5 enables the areaprovided by the strip material from which the carrier strip 1 and theholding elements 2 are formed to be efficiently utilised. At a fixedwidth of the carrier strip 1, the holding elements 2 have relativelylong first and second holding arms 12, 13 and first and second legs 21,22 of relatively thick material. The holding element 2 preferably has amaterial thickness that corresponds to the thickness of the stripmaterial. This is possible because a relatively long strip of materialof the original strip material is used to produce the holding elements2. The material present is therefore efficiently utilised.

[0057] The described arrangement furthermore offers the advantage thatthe carrier strip 1 and the holding elements 2 can be formed by simplepunching and stamping processes from a flat sheet-form strip material.In this way, a simple and cost-efficient manufacture of the holdingelements 2 and the carrier strip 1 is possible.

[0058] Furthermore, the strip-form of the holding 2, resulting from thefact that the holding element 2 has a clearly larger width than materialthickness, is clearly apparent from FIG. 5. The material thickness liesin the range from 0.1 to 0.6 mm. FIG. 6 shows a preferred embodiment,which the supporting surface 11 has an insulating connecting piece 49,which divides the holding element 2 into two electrically separateparts. In this embodiment, the solder layer 33 for the two parts is alsoformed in separate parts. This offers the advantage that a carrier board32 can be supplied via a holding element 2 with two different voltages.

[0059] It will be understood by those skilled in the art that thepresent invention is not limited to the embodiments shown and that manyadditions and modifications are possible without departing from thescope of the present invention as defined in the appending claims.

1. A holding element (2) having a holding clip (19) with a first and asecond holding arm (12, 13), wherein the holding arms (12, 13) extendfrom a supporting region (11) and between the holding arms (12, 13) areceiving region (31) is formed, wherein the first holding arm (12) isconnected to a first leg (21) and the second holding arm (13) isconnected to a second leg (22), said legs each having a base (45) in theend region, characterised in that the holding element is made of a stripmaterial and in that the first and second holding arms (12, 13) eachhave an outward bend (20) forming a transition into the first and secondleg (21, 22) respectively.
 2. A holding element according to claim 1,characterised in that the first and the second leg (21, 22) are ofsymmetrical construction.
 3. A holding element according to one ofclaims 1 and 2, characterised in that the holding element (2) ismanufactured from a plane band by a shaping process.
 4. A holdingelement according to any one of claims 1 to 3, characterised in that aleg (21, 22) has a curved surface in the region of the base (45).
 5. Aholding element according to claim 4, characterised in that thecurvature is arranged in the longitudinal axis of a leg (21, 22).
 6. Aholding element according to any one of claims 1 to 5, characterised inthat the holding arms (12, 13) are arranged at a given distance apartand the holding arms (12, 13) are biased against outward bending.
 7. Aholding element according to any one of claims 1 to 6, characterised inthat the supporting region (11) is in the form at least partly of avirtually flat surface (14).
 8. A holding element according to any oneof claims 1 to 7, characterised in that a solder layer (33) is arrangedon the supporting region (11).
 9. A holding elect according to any oneof claims 1 to 8, characterised in that the holding element (2) consistsof a copper alloy and the holding element (2) is covered at least partlyby a tin layer (48).
 10. A holding element according to any one ofclaims 1 to 9, characterised in that a lower edge of the supportingregion (11) is arranged above a straight connecting line that runsbetween the bases (45) of a first and second leg (21, 22) of a holdingelement (2).
 11. A holding element according to any one of claims 5 to10, characterised in that the curvature of the base (45) has a radiusbetween 0.3 mm and 0.7 mm.
 12. A holding element according to any one ofclaims 1 to 11, characterised in that at least part of the supportingregion (11) across the entire width is manufactured from an insulatingmaterial (49).
 13. A arrangement with a carrier board (32) and a holdingelement (2), wherein the carrier board (32) is arranged in a receivingregion (31) of the holding element (2), characterised in that theholding element is constructed according to any one of claims 1 to 12.14. An arrangement according to claim 13, characterised in that thecarrier board (32) lies with a flat side face (43) on a virtually flatsupporting region (11) of the holding element (2).
 15. An arrangementaccording to one of claims 13 and 14, characterised in that the carrierboard (32) is connected by way of a solder layer (33) with thesupporting face (11) or with at least one holding arm (12, 13).
 16. Anarrangement with a holding element (2) and a carrier strip (1), whereinthe holding element (2) is connected to the carrier strip (1), whereinthe holding element (2) and the carrier strip (1) are integral formed,characterised in that the carrier strip (1) has ties (4) that arrangedside by side, the ties (4) are a given lateral distance apart, theholding element (2) is arranged between two ties (4).
 17. An arrangementaccording to claim 16, characterised in that the carrier strip (1) has afirst and a second row (46, 47) of ties (4), the ties (4) of the tworows are arranged symmetrically with respect to and opposite oneanother, the holding element (2) is connected with two ties (4) and afirst tie (4) belongs to the first row (46) and a second tie belongs tothe second row (47).
 18. An arrangement according to claim 17,characterised in that opposing ties (4) of two rows (46, 47) are a givendistance apart.
 19. An arrangement according to any one of claims 16 to18, characterised in that the holding element (2) comprises a holdingclip (19) with a receiving region (31), the receiving region (31) isbounded by a plane supporting face (11), and the holding element (2) isconnected in the region of the plane supporting face with the carrierstrip (1).
 20. An arrangement according to any one of claims 16 to 19,characterised in that the carrier strip (1) has at least one spacer (9,10), the spacer (9, 10) extends to an upper or a lower holding distance,and the upper or lower holding distance is greater than a respectiveupper or lower distance to which the holding element (2) endsrespectively upwards or downwards from the carrier strip (1).
 21. Anarrangement according to any one of claims 16 to 20, characterised inthat a spacer (8, 9) is arranged between two adjacent ties (4) and thespacers (8, 9) are of integral construction with the carrier strip (1).22. An arrangement according to one of claims 20 and 21, characterisedin that the spacers (8, 9) of a row (46, 47) are constructed alternatelyupwards and downwards.